The Philosophy and Motivation behind the D3DSP Invention

Objects vs. Layers: The D3DSP

 The Earth’s Seismic Duality and a New Process For Imaging, Measuring and Evaluating Subterranean “Common-Impedance Objects” (CIOs)

This paper explains the similarities and differences between the D3DSP and commonly applied Conventional-3D-Seismic Processes. It also explains the rationale behind the introduction of this unconventional new method of looking seismically into the earth.  It is presently being used to drill to depths greater than 1000 feet.  The deepest depth of usefulness for the D3DSP is governed by the surface dimensions (size and shape) of the seismic survey.  The larger the survey area (i.e., the more square miles and the more similar the east-west and north-south dimensions - square or circular are best), the deeper becomes the usefulness of the D3DSP.   For example, in many geographical areas, well imaged 20,000-30,000 feet deep targets are definitely possible for a 75-square-mile D3D-reprocessed seismic survey (e.g., 46,000 x 46,000 feet).

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